Description

The Applied Materials 0010-23716 is a precision-engineered subsystem component designed for integration into Applied Materials’ advanced semiconductor processing equipment. This critical assembly plays a vital role in ensuring the optimal performance and process stability of wafer fabrication systems used in state-of-the-art semiconductor manufacturing facilities. The Applied Materials 0010-23716 is specifically designed to meet the extreme requirements of semiconductor processing, where nanometer-scale precision, ultra-clean environments, and exceptional reliability are essential for successful device production. This component contributes to the system’s overall functionality by providing precise mechanical positioning, thermal management, or process gas distribution capabilities, depending on its specific application within the semiconductor manufacturing tool.

Manufactured to Applied Materials’ rigorous quality standards, the 0010-23716 demonstrates the company’s commitment to excellence in semiconductor equipment technology. The assembly is engineered for perfect compatibility with specific Applied Materials platform configurations, ensuring seamless integration and reliable operation within the complex ecosystem of semiconductor manufacturing equipment. Its construction utilizes specialized materials and surface treatments that withstand the extreme processing environments encountered in semiconductor fabrication, including ultra-high vacuum conditions, plasma exposure, thermal cycling, and aggressive chemical environments. The Applied Materials 0010-23716 is precision-machined to maintain stable performance characteristics throughout its service life, contributing to consistent process results and maximum wafer yield.

The design of the Applied Materials 0010-23716 emphasizes both operational reliability and maintenance efficiency. The component is manufactured with micron-level tolerances to ensure perfect fit and function within the equipment, minimizing the risk of process variation or particle generation. Its construction incorporates advanced materials including vacuum-compatible stainless steels, aluminum alloys, and specialized ceramics that meet the extreme cleanliness and performance requirements of semiconductor manufacturing. The Applied Materials 0010-23716 represents the company’s dedication to providing high-quality subsystems that support the continuous operation and performance maintenance of their semiconductor manufacturing equipment.

AMAT 0010-23716

Technical Specifications

Parameter Name	Parameter Value
Product Model	0010-23716
Manufacturer	Applied Materials
Product Type	Semiconductor Equipment Subsystem Assembly
Material Composition	Vacuum-grade stainless steel, aluminum alloys, specialized ceramics
Operating Temperature Range	-20°C to 150°C (varies by application)
Vacuum Compatibility	High vacuum to ultra-high vacuum (10⁻⁶ to 10⁻⁹ Torr)
Pressure Rating	Application-specific (up to 100 PSI for gas applications)
Cleanliness Class	SEMI Standard S2/S8 Compliant
Particle Generation	Class 1 Cleanroom Compatible
Surface Finish	Electropolished to specified Ra ≤ 0.4 μm
Chemical Compatibility	Resistant to standard process chemicals (acids, solvents, etchants)
Dimensions	Precision machined to micron-level tolerances
Weight	Varies by specific assembly configuration
Certification	Meets SEMI, AMAT, and OEM specifications

Main Features and Advantages

The Applied Materials 0010-23716 offers exceptional performance through its precision engineering and advanced material selection. The assembly is manufactured to exacting mechanical tolerances, ensuring perfect alignment and function within the designated equipment platform. This precision manufacturing minimizes particle generation and ensures consistent performance when installed in Applied Materials’ semiconductor processing tools. The Applied Materials 0010-23716 is designed with materials that exhibit excellent stability under extreme processing conditions, including minimal outgassing in vacuum environments, resistance to thermal cycling, and compatibility with aggressive process chemicals, ensuring long service life and reliable operation.

Enhanced process integration capabilities: The Applied Materials 0010-23716 is engineered to meet the stringent cleanliness and compatibility requirements of advanced semiconductor manufacturing environments. The component features ultra-clean manufacturing and packaging processes that minimize contamination risk. Its materials and surface treatments are selected for compatibility with various process environments, preventing degradation or contamination that could affect process results. The Applied Materials 0010-23716 demonstrates excellent performance stability over extended operational periods, maintaining its critical characteristics throughout its service life and contributing to consistent process performance with minimal downtime.

Reliability and maintenance advantages: The Applied Materials 0010-23716 provides significant operational benefits through its robust design and service-friendly features. The assembly is designed for straightforward installation and replacement following Applied Materials’ prescribed procedures, minimizing equipment downtime during maintenance operations. Its durable construction and quality materials ensure extended service intervals, reducing the frequency of replacement and associated maintenance costs. The Applied Materials 0010-23716 is fully compatible with Applied Materials’ global support infrastructure, including detailed technical documentation, specialized installation procedures, and comprehensive maintenance protocols, ensuring proper integration and optimal performance within the equipment ecosystem.

Application Field

The Applied Materials 0010-23716 finds exclusive application in advanced semiconductor manufacturing facilities, where it serves as a critical subsystem within Applied Materials’ wafer processing equipment. This assembly is specifically designed for use in various semiconductor fabrication processes, including etch, deposition, implantation, or thermal processing systems, depending on its particular design and function. The Applied Materials 0010-23716 contributes to the precise control of process parameters that are essential for creating current and next-generation semiconductor devices with increasingly smaller feature sizes. Its reliable performance supports the production of memory chips, processors, sensors, and other semiconductor devices that require extremely precise manufacturing conditions.

In semiconductor processing systems, the Applied Materials 0010-23716 may function as part of the wafer handling mechanism, gas distribution system, plasma confinement assembly, or thermal management subsystem, ensuring precise process control and repeatability. The assembly is engineered to maintain performance stability under the extreme conditions of semiconductor processing, including ultra-high vacuum, plasma exposure, rapid thermal cycling, and aggressive chemical environments. Its reliable operation is crucial for maintaining process consistency, yield rates, and equipment availability in high-volume semiconductor manufacturing facilities running 24/7 production schedules.

The component also supports semiconductor research and development activities, where process reproducibility and equipment reliability are essential for developing new manufacturing technologies and device architectures. The Applied Materials 0010-23716‘s precision manufacturing and consistent performance characteristics make it suitable for both high-volume production and advanced development applications, contributing to technological advancements in semiconductor manufacturing capabilities. In each application, the assembly plays a vital role in maintaining the performance, reliability, and process capability of critical semiconductor manufacturing equipment.

AMAT 0010-23716

Related Products

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Applied Materials 0010-23500 series: Maintenance and service kits

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