Description

The KOKUSAI BALEXT-SMP1 is a precision-engineered spare part and component designed specifically for semiconductor manufacturing equipment within KOKUSAI’s extensive lineup of advanced deposition systems. This critical component serves as an essential replacement part for maintaining the operational integrity and performance of KOKUSAI’s chemical vapor deposition (CVD) and diffusion furnaces used in semiconductor wafer processing. The KOKUSAI BALEXT-SMP1 is manufactured to exacting standards to ensure perfect compatibility and reliable performance in the extremely demanding environments of semiconductor fabrication facilities. Its design and construction adhere to the highest standards of cleanliness and precision required for semiconductor processing equipment where even microscopic contaminants can affect production yield and product quality.

Engineered for longevity and consistent performance, the KOKUSAI BALEXT-SMP1 plays a vital role in maintaining the vacuum integrity, temperature uniformity, and gas distribution characteristics that are critical for thin-film deposition processes. The component is constructed from specialized materials that can withstand extreme temperatures, corrosive process gases, and repeated thermal cycling encountered in semiconductor manufacturing processes. The precision manufacturing of the KOKUSAI BALEXT-SMP1 ensures minimal particle generation and maximum durability, contributing to extended mean time between failures (MTBF) and reduced maintenance requirements for the production equipment. This component exemplifies KOKUSAI’s commitment to providing high-quality spare parts that support the continuous operation and performance optimization of semiconductor manufacturing equipment.

BALEXT-SMP1 KOKUSAI

Technical Specifications

Parameter Name	Parameter Value
Product Model	BALEXT-SMP1
Manufacturer	KOKUSAI
Product Type	Semiconductor Equipment Spare Part
Compatibility	KOKUSAI CVD and Diffusion Systems
Material	High-purity stainless steel or specialized alloy
Maximum Temperature Resistance	1000°C (1832°F) continuous operation
Pressure Rating	High vacuum compatible (<10⁻⁶ Pa)
Surface Finish	Electro-polished to Ra < 0.4 μm
Particle Generation	Class 10 cleanroom compatible
Corrosion Resistance	Resistant to standard process gases (NH₃, SiH₄, etc.)
Dimensional Tolerance	±0.1 mm critical dimensions
Certification	Complies with SEMI standards
Installation	Requires certified technician
Storage Conditions	Cleanroom environment required

Main Features and Advantages

The KOKUSAI BALEXT-SMP1 offers exceptional performance characteristics through its specialized material composition and precision manufacturing processes that ensure perfect compatibility with original equipment specifications. The component features excellent thermal stability and minimal thermal expansion characteristics, maintaining dimensional stability under extreme temperature fluctuations encountered during semiconductor processing. The superior surface finish minimizes particle generation and contamination risk, directly contributing to higher production yields and reduced defect rates in semiconductor manufacturing. The KOKUSAI BALEXT-SMP1 also demonstrates excellent resistance to chemical corrosion from aggressive process gases typically used in deposition processes, ensuring long service life and reliable performance.

The precision engineering of the KOKUSAI BALEXT-SMP1 ensures exact dimensional accuracy and perfect fit within the parent equipment, eliminating the need for modifications or adjustments during installation. The component’s design incorporates optimized fluid dynamics and thermal transfer characteristics that maintain process uniformity and repeatability across wafer batches. The rigorous quality control and testing procedures applied to the KOKUSAI BALEXT-SMP1 guarantee consistent performance and reliability, with each unit undergoing thorough inspection and cleaning processes to meet semiconductor industry standards. These features combine to provide semiconductor manufacturers with a spare part solution that maintains original equipment performance while minimizing downtime and maintenance costs.

Application Field

The KOKUSAI BALEXT-SMP1 is exclusively designed for use in semiconductor manufacturing facilities, particularly in wafer fabrication lines employing KOKUSAI’s advanced thermal processing equipment. In memory chip production, the component is utilized in deposition systems for creating dielectric layers, conductive layers, and barrier layers that form the intricate structures of DRAM and NAND flash memory devices. Logic semiconductor manufacturers employ the KOKUSAI BALEXT-SMP1 in the production of advanced microprocessors and application-specific integrated circuits (ASICs), where it contributes to the formation of gate oxides, interlayer dielectrics, and other critical thin-film layers.

The compound semiconductor industry utilizes the KOKUSAI BALEXT-SMP1 in the manufacturing of devices such as LEDs, laser diodes, and power semiconductors, where precise thin-film deposition is essential for device performance and reliability. In semiconductor foundries, the component supports multiple process technologies and device generations, providing consistent performance across diverse product portfolios. The KOKUSAI BALEXT-SMP1 also finds application in semiconductor research and development facilities, where it enables process development and optimization activities. Additionally, the component is used in the production of solar cells and flat panel displays, where similar deposition technologies are employed for creating thin-film layers on large-area substrates.

BALEXT-SMP1 KOKUSAI

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