Description

The Hybricon PCI354-1022-38 02088-019 is a high-performance hybrid backplane engineered to support both VME64x and PCI bus architectures within a single ruggedized chassis. Designed for mission-critical industrial, defense, and energy applications, this backplane enables system integrators to combine legacy VME-based control modules with modern PCI-based processing or communication cards—offering unmatched flexibility without compromising reliability. The Hybricon PCI354-1022-38 02088-019 features 14 slots configured to accommodate a mix of VME64x (P0/P1/P2) and 32-bit/33 MHz PCI connectors, making it ideal for upgrading systems like GE’s Mark VIe, Triconex TMR platforms, or custom military computing enclosures.

Built to meet stringent environmental standards, the Hybricon PCI354-1022-38 02088-019 supports conduction cooling through card guides with integral thermal planes, eliminating the need for forced-air ventilation in sealed or explosive atmospheres. Its robust mechanical design complies with IEEE 1101.10/11 and IEC 60297-3 standards, ensuring compatibility with standard 6U Eurocards while providing enhanced shock and vibration resistance. As a foundational component in modular embedded systems, the Hybricon PCI354-1022-38 02088-019 delivers stable power distribution, precise signal integrity, and long-term availability—critical for industries where system obsolescence and downtime carry significant operational risk.

Hybricon PCI354-1022-38 02088-019

Technical Specifications

Parameter Name	Parameter Value
Product Model	PCI354-1022-38 02088-019
Manufacturer	Hybricon (now part of Elma Electronic)
Product Type	Hybrid VME64x / PCI Backplane
Number of Slots	14 (mixed VME64x and PCI)
Bus Standards Supported	VME64x (IEEE 1014), PCI 2.2 (32-bit, 33 MHz)
Cooling Method	Conduction-cooled (compatible with 0.8″ or 1.0″ pitch card guides)
Operating Temperature	-40°C to +85°C (conduction-cooled environment)
Power Input Connectors	Standard IEC 60603-2 or MIL-DTL-55302-compatible
PCB Layers	10-layer, impedance-controlled stack-up
Compliance	IEEE 1101.10/11, IEC 60297-3, RoHS
Dimensions (W×H×D)	354 mm × 233.35 mm × Approx. 10 mm (PCB only)
Mounting	Flanged edges for secure chassis integration

Main Features and Advantages

Hybrid Bus Architecture: The Hybricon PCI354-1022-38 02088-019 uniquely bridges two generations of industrial computing by integrating VME64x and PCI buses on a single backplane. This allows users to retain proven VME-based I/O or safety modules (e.g., from GE or Triconex) while adding high-speed PCI-based controllers, Ethernet cards, or FPGA accelerators—extending system life without full redesign.

Conduction Cooling for Extreme Environments: Unlike air-cooled alternatives, the Hybricon PCI354-1022-38 02088-019 transfers heat directly from plug-in cards to the chassis via thermally conductive card guides. This design is essential for naval vessels, oil rigs, or desert-based substations where dust, humidity, or explosive gases prohibit internal fans.

Robust Signal Integrity: With controlled impedance traces, ground planes, and minimized crosstalk, the Hybricon PCI354-1022-38 02088-019 maintains signal fidelity across high-speed PCI clocks and sensitive analog VME lines. This ensures reliable data transmission even under electromagnetic interference from large motors or RF sources.

Long-Term Availability & Obsolescence Mitigation: Hybricon’s commitment to extended product lifecycles makes the Hybricon PCI354-1022-38 02088-019 a strategic choice for infrastructure projects requiring 15–20 years of support. Its standardized form factor also simplifies future upgrades or replacements within the same chassis family.

Defense and Industrial Heritage: Originally developed for military computing, this backplane inherits ruggedness tested in avionics, radar, and shipboard systems. Today, it powers civilian critical systems—from turbine control racks to railway signaling—where failure is not an option.

Application Field

The Hybricon PCI354-1022-38 02088-019 is widely deployed in sectors demanding extreme reliability and mixed-technology integration. In power generation, it serves as the backbone of upgraded GE Mark VIe turbine control cabinets, where legacy VME-based I/O modules coexist with new PCI-based communication gateways for OPC UA or Modbus TCP. Similarly, in process safety systems, companies retrofitting Triconex TMR logic solvers use this backplane to add modern HMI interfaces or cybersecurity appliances without replacing the entire chassis.

Defense and aerospace integrators utilize the Hybricon PCI354-1022-38 02088-019 in mission computers for fighter jets, naval combat systems, and ground vehicles—leveraging its conduction cooling and MIL-spec durability. In rail transportation, it supports signaling and traction control units that must operate continuously across wide temperature swings and high-vibration conditions. Oil & gas offshore platforms also rely on this backplane in subsea control pods and topside DCS enclosures, where sealed, fanless operation prevents salt corrosion and methane ignition risks. Across all these fields, the Hybricon PCI354-1022-38 02088-019 provides a future-proof, rugged foundation for hybrid embedded systems.

Hybricon PCI354-1022-38 02088-019

Related Products

PCI354-1022-38: Base model number; 02088-019 is Hybricon’s internal revision/spec code
PCI354-1022-36: Similar 12-slot variant with different slot allocation
VME354-1022-38: VME-only version of the same form factor backplane
Hybricon 02088-020: Updated revision with enhanced grounding for higher EMC performance
Elma ELPAC 6U Conduction-Cooled Chassis: Compatible enclosure for PCI354-1022-38 02088-019
GE IS215VCMIH2A: VME communications card often installed in systems using this backplane
Triconex 3700A: Triple-modular redundant controller compatible with VME slots on this backplane
Hybricon 02088-015: Earlier revision with air-cooled (not conduction-cooled) design